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PRELIMINARY
MX23L6414
64M-BIT MASK ROM
FEATURES
* Bit organization - 8Mb x 8 (byte mode) - 4Mb x 16 (word mode) * Fast access time - Random access:90/25ns(max.) * Page Size - 8 words per page * Current - Operating:20mA - Standby:15uA(max.) * Supply voltage - VCC : 2.7 ~ 3.6V - VCCQ : 2.7 ~ 3.6V * Package - 64 ball mini BGA (10.0mm X 13.0mm, ball pitch 1.0mm) - 56 pin TSOP (14mm x 20mm) * Temperature - -25~85 C
PIN DESCRIPTION
Symbol A0~A22 Pin Function Address Inputs, A0 not used in word mode D0~D15 Data Outputs CE0#, CE1# Chip Enable Input CE2# OE# Output Enable Input BYTE# Word/Byte mode Selection VCC Power Supply Pin VCCQ Output VCC Pin GND Ground Pin NC No Connection
CHIP ENABLE TRUTH TABLE
CE2# CE1# CE0# L L L L L H L H L L H H H L L H L H H H L H H H Note: for single-chip applications, CE2#, strapped to GND. Device Enabled Disabled Disabled Disabled Enabled Enabled Enabled Disabled CE1# can be
PIN CONFIGURATION
56 TSOP (Normal Type)
A22 CE1# A21 A20 A19 A18 A17 A16 VCC A15 A14 A13 A12 CE0# NC NC A11 A10 A9 A8 GND A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 NC NC OE# NC D15 D7 D14 D6 GND D13 D5 D12 D4 VCCQ GND D11 D3 D10 D2 VCC D9 D1 D8 D0 A0 BYTE# NC CE2#
MX23L6414
P/N:PM0766
REV. 1.5, MAY. 26, 2005
1
MX23L6414
64 Mini BGA (Top View, Balls Facing Down)
A1 A1 B1 A2 C1 A3 D1 A4 E1 D8 F1 BYTE# G1 NC H1 CE2# A2 A6 B2 GND C2 A7 D2 A5 E2 D1 F2 D0 G2 A0 H2 NC A3 A8 B3 A9 C3 A10 D3 A11 E3 D9 F3 D10 G3 D2 H3 VCC A4 NC B4 CE0# C4 A12 D4 NC E4 D3 F4 D11 G4 VCCQ H4 GND A5 A13 B5 A14 C5 A15 D5 NC E5 D4 F5 D12 G5 D5 H5 D13 A6 VCC B6 NC C6 NC D6 NC E6 NC F6 NC G6 D6 H6 GND A7 A18 B7 A19 C7 A20 D7 A16 E7 D15 F7 NC G7 D14 H7 D7 A8 A22 B8 CE1# C8 A21 D8 A17 E8 NC F8 OE# G8 NC H8 NC 13.0 mm
10.0 mm
MODE SELECTION
CE# Disabled Enabled Enabled Enabled OE# X H L L Byte# X X L H D0~D7 High Z High Z D0~D7 D0~D7 D8~D15 High Z High Z High Z D8~D15 Power Stand-by Active Active Active
ORDER INFORMATION
Part No. MX23L6414TI-90 MX23L6414TI-10 MX23L6414TI-12 MX23L6414XI-90 MX23L6414XI-10 MX23L6414XI-12 MX23L6414XI-12G Speed 90ns 100ns 120ns 90ns 100ns 120ns 120ns Package 56 pin TSOP 56 pin TSOP 56 pin TSOP 64 ball mini BGA 64 ball mini BGA 64 ball mini BGA 64 ball mini BGA Grade Industrial Industrial Industrial Industrial Industrial Industrial Industrial Remark
Pb-free
Note: Industrial grade temperature: -25 ~ 85 C Commercial grade temperature: 0 ~ 70 C
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MX23L6414
ABSOLUTE MAXIMUM RATINGS
Item Voltage on any Pin Relative to VSS Ambient Operating Temperature Storage Temperature Symbol VIN Topr Tstg Ratings -0.3V to 3.9V -25 C to 85 C -65 C to 125 C
DC CHARACTERISTICS (Ta = -25 C ~ 85 C, VCC = 2.7V~3.6V)
Item Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Input Leakage Current Output Leakage Current Operating Current Standby Current (CMOS) Input Capacitance Output Capacitance Symbol VOH VOL VIH VIL ILI ILO ICC ISTB CIN COUT MIN. 2.4V 2.2V -0.5V -10 MAX. 0.4V VCCQ+0.5V 0.8V 10uA 10uA 20mA 15uA 10pF 10pF 0V, VCC 0V, VCC f=5MHz, CE#=VIL, OE#=VIH all output open CE#>VCC-0.2V Ta = 25 C, f = 1MHZ Ta = 25 C, f = 1MHZ Conditions IOH = -400uA IOL = 1.6mA
AC CHARACTERISTICS (Ta = -25 C ~ 85 C, VCC = 2.7V~3.6V)
Item Read Cycle Time Address Access Time Chip Enable Access Time Page Mode Access Time Output Enable Time Output Hold After Address Output High Z Delay Symbol tRC tAA tACE tPA tOE tOH tHZ 23L6414-90 MIN. 90ns 0ns MAX. 90ns 90ns 25ns 25ns 20ns 23L6414-10 MIN. 100ns 0ns MAX. 100ns 100ns 25ns 25ns 20ns 23L6414-12 MIN. 120ns 0ns MAX. 120ns 120ns 25ns 25ns 20ns
Note:Output high-impedance delay (tHZ) is measured from OE# or CE# going high, and this parameter guaranteed by design over the full voltage and temperature operating range - not tested.
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REV. 1.5, MAY. 26, 2005
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MX23L6414
AC Test Conditions
Input Pulse Levels Input Rise and Fall Times Input Timing Level Output Timing Level Output Load 0.4V~2.4V 5ns 1.5V 1.5V See Figure 100pF output load capacitance
IOH (load)=-400uA DOUT IOL (load)=1.6mA
C<100pF
Note:No output loading is present in tester load board. Active loading is used and under software programming control.
TIMING DIAGRAM
RANDOM READ
Output loading capacitance includes load board's and all stray capacitance.
ADD
ADD
tACE
ADD
tRC
ADD
CE#
tOE
OE#
tAA tOH tHZ
DATA
VALID
VALID
VALID
PAGE READ
A4-A22
VALID ADD
A0,A1,A2,A3
1'st ADD tAA
2'nd ADD tPA VALID VALID
3'rd ADD
DATA
VALID
Note: CE#, OE# are enable. Page size is 8 words in 16-bit mode, 16 bytes in 8-bit mode.
P/N:PM0766
REV. 1.5, MAY. 26, 2005
4
MX23L6414
REVISION HISTORY
Revision 1.0 Description Page 1. Random access:90/35(max.)-->80/25(max.) P1,3 2. Add page size -- 8 words per page P1 3. Package:64 ball mini BGA(8.0mmx10.0mm)-->64ball mini BGA P1 (10.0x13.0mm) 4. Add Order Information P2 5. Modify Standby Current:10uA-->15uA P1,3 6. Change heading as "RELIMINARY " P1 1. Modify DC Characteristics--VOH:VCCQ-0.2V-->2.4V, IOH=-100uA--> P3 -400uA, VOL:0.2V-->0.4V, IOL:100uA-->1.6mA, VIH:2.0-->2.2V 2. Modify AC Test Conditions--Input Pulse Levels:0~VCCQ-->0.4V~2.4V, P4 Input/Output Timing Level:VCCQx0.5-->1.5V, Output Load:30pF--> 100pF output load capacitance Add CE#=VIL, OE#=VIH in DC Characteristics's ICC P3 1. Modify fast access time:80ns-->90ns P1~3 1. Modify Operating Current : 40 --> 20mA P1,3 1. Added Pb-free package P2 Date AUG/29/2001
1.1
SEP/10/2001
1.2 1.3 1.4 1.5
OCT/02/2001 MAY/07/2002 DEC/31/2002 MAY/26/2005
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MX23L6414
MACRONIX INTERNATIONAL CO., LTD.
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http : //www.macronix.com
MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.

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